| 摘要 |
<p>[Problem] In a thermal head including a circuit board, occurrence of electromagnetic interference is reduced. [Solution] A thermal head (X) of the invention includes a head base (3) having a substrate (7) and a plurality of heat-generating sections (9) arranged on or above the substrate (7), a circuit board (5), a drive IC (11) disposed on or above the substrate (7) of the head base (3) or on or above the circuit board (5), the drive IC controlling energizing states of the heat-generating sections (9), and a cover member (6) having electric conductivity, disposed at least above the circuit board (5). The circuit board (5) has a plurality of signal wirings (5by) for supplying electric signals for operating the drive IC (11). A face on a circuit board (5) side of the cover member (6) has an inclined region (6T1) located above the signal wiring (5by). The inclined region (6T1) is composed of at least one inclined surface which is inclined with respect to a face on an inclined region (6T1) side of the signal wiring (5by).</p> |
