发明名称 WIRE SPRING DAMPING STRUCTURE OF CAMERA MODULE
摘要 PURPOSE: A wire spring shock absorbing structure of a small camera module is provided to prevent the separation of a joint portion of a wire spring as the elastic portion disperses the focused impact on both end portions of a wire spring absorbing the impact added to a wire spring when a camera is shaken. CONSTITUTION: A wire spring shock absorbing structure of a small camera module comprises a lens holder(500), a plurality of electrode plates(600), a fixing unit(200), a circuit board(300), and a wire spring(700). A camera lens is mounted on the lens holder. The electrode plates are mounted on the lens holder and electrically connected to the lens holder. The fixing unit is separately arranged adjacently to the lens holder. The circuit board is mounted on the fixing unit. One end of the wire spring is connected to the circuit board, and the other end of the wire spring is connected to the electrode plates. The wire spring couples the lens holder with the fixing unit to be movable. The other end of the wire spring is connected to an elastic portion so that the elastic portion absorbs the impact delivered to the wire spring.
申请公布号 KR101239685(B1) 申请公布日期 2013.03.06
申请号 KR20120004430 申请日期 2012.01.13
申请人 HYSONIC CO., LTD. 发明人 PARK, CHANG WOOK
分类号 G03B13/36;G03B17/02 主分类号 G03B13/36
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