PURPOSE: A manufacturing method of a PCB is provided to reduce time and costs for manufacturing by utilizing resist ink as a mask for forming a conductive layer. CONSTITUTION: A first resist ink is applied to the part of a substrate. A first resist layer is formed(S110). A second resist ink is applied to the part of the substrate for covering the first resist layer. A second resist layer is formed(S130). A conductive layer is formed at the rest parts of the substrate. The flexibility of the first resist layer is higher than the flexibility of the second resist layer. The adhesion of the second resist layer is higher than the adhesion of the first resist layer. [Reference numerals] (S110) Forming a first resist layer by applying a first resist ink to the part of a substrate; (S120) Hardening the first resist layer by heating; (S130) Forming a second resist layer by applying a second resist ink for covering the first resist layer on the part of the substrate; (S140) Hardening the second resist layer by heating; (S150) Forming a first surface processing layer on a first pad; (S160) Removing the first resist layer and the second resist layer; (S170) Forming a second surface processing layer on a second pad
