| 发明名称 |
Multilayer printed circuit board using flexible interconnect structure, and method of making same |
| 摘要 |
<p>A multilayer printed circuit board includes an interior interconnect layer (25), and a semiconductor package including a flexible interconnect structure whose distal end is a free end, wherein the flexible interconnect structure (14) and the interior interconnect layer are electrically connected to each other.</p> |
| 申请公布号 |
EP2389049(B1) |
申请公布日期 |
2013.03.06 |
| 申请号 |
EP20110158346 |
申请日期 |
2011.03.15 |
| 申请人 |
FUJITSU LIMITED |
发明人 |
KANAI, RYO;KIKUCHI, SHUNICHI;NAKAMURA, NAOKI;SUGINO, SHIGERU;HATANAKA, KIYOYUKI;TAKETOMI, NOBUO |
| 分类号 |
H05K1/14;H01L23/498;H01L23/538;H05K1/18 |
主分类号 |
H05K1/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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