LIGHT EMITTING DEVICE PACKAGE

摘要

PURPOSE: A light emitting device package is provided to prevent a yellow ring phenomenon due to thermal stress by mounting a light emitting diode chip on an electrode layer after a first concave part is formed. CONSTITUTION: An electrode layer(220) includes a first electrode layer(221) and a second electrode layer(222) which are separated. A first concave part(C1) is formed on the part of the first electrode layer. A second concave part(C2) is formed on the first electrode layer and the second electrode layer. A light emitting diode chip(250) is arranged on the first concave part of the first electrode layer. An insulation pattern(210) is arranged on the lower side of the electrode layer.