| 摘要 |
PURPOSE: A power semiconductor package and a manufacturing method thereof are provided to efficiently discharge heat from a package by not requiring an additional adhesive member between the lead frame and a heat sink. CONSTITUTION: A lead frame(110) has a first side and a second side which face each other. A semiconductor chip is attached to the first side of the lead frame. A sealing resin(140) surrounds the lead frame mounting the semiconductor chip except an external connection terminal and includes a groove which exposes a part of the second side of the lead frame. A ceramic heat sink(130) fills the groove of epoxy molding compound. One side of the ceramic heat sink is directly contacted with the second side of the lead frame and the other side thereof is exposed to the outside of the package. |
