发明名称 HEAT SINK MODULE
摘要 PURPOSE: An integrated radiator heat exchanger and a manufacturing method thereof are provided to increase areas in contact with electronic components by partially removing a radiation fin formed through a skiving method. CONSTITUTION: A panel-shaped body unit having excellent thermal conductivity is prepared and a radiation fin is continuously formed by skiving the top surface of the body unit in a longitudinal direction(S12). The radiation fin is removed from the center of the body unit(S13). The edge part of the body unit including the radiation fin is bent(S14). A fan module is combined with the radiation fin. [Reference numerals] (S11) Step of preparing a panel-shaped body unit having excellent thermal conductivity; (S12) Step of continuously forming a radiation fin by skiving the top surface of the body unit in the longitudinal direction; (S13) Step of removing the radiation fin from the center of the body unit; (S14) Step of bending the edge part of the body unit including the radiation fin
申请公布号 KR20130021635(A) 申请公布日期 2013.03.06
申请号 KR20110084016 申请日期 2011.08.23
申请人 PARANG INC. 发明人 KIM, DAE JOON
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
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