PURPOSE: A method for manufacturing a semiconductor device is provided to prevent a leakage current on an interface by forming an epitaxial layer between an active region and a bottom electrode of a capacitor. CONSTITUTION: A bit line(170) is formed on a substrate(110) including an active region(114). An interlayer dielectric layer is formed on the substrate to cover the bit line. A first hole(1H) passing through the interlayer dielectric layer is formed in the active region. A dummy contact layer is formed by filing the first hole. A mold layer is formed on the interlayer dielectric layer and the dummy contact layer. A second hole(2H) passing through the mold layer is formed on the dummy contact layer. An epitaxial layer(140) is formed in the active region exposed from the bottom of the first hole. A bottom electrode(152) is formed in the inner wall of the first hole and the second hole.
申请公布号
KR20130021661(A)
申请公布日期
2013.03.06
申请号
KR20110084063
申请日期
2011.08.23
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, KWANG WOOK;LEE, SANG JUN;HWANG, IN SEAK;JEON, IN SANG;GWAK, BYOUNG YONG;AN, HO KYUN