| 摘要 |
PURPOSE: An electronic component heat sink module and a manufacturing method thereof are provided to improve a surface which touches electronic components by partly removing heat sink pins of a body unit. CONSTITUTION: A body unit including excellent thermal conductance is prepared(S11). A heat sink pin is successively formed by cutting an upper surface of the body unit(S12). The heat sink pin arranged in a center unit of the body unit is removed(S13). A boundary unit of the body unit including the heat sink pin is curved(S14). A fan module is combined with the heat sink pin. [Reference numerals] (S11) Step of preparing a planar body unit with excellent thermal conductance; (S12) Step of continuously forming heat sink pins by skiving the upper surface of the body unit to the longitudinal direction; (S13) Step of removing the heat sink pins from the center of the body unit; (S14) Step of curving the boundary with the heat sink pins of the body unit
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