| 摘要 |
<p>1,242,237. Splitting semi-conductor material. ASSOCIATED SEMICONDUCTOR MFGS. Ltd. 29 Nov., 1968, No. 56792/68. Heading B5E. [Also in Divisions B2A, F2A and H1K] A scored semi-conductor wafer 11 is broken into dice by means of a roller arrangement comprising a working roller 3 of a magnetic material, e.g. hardened steel, magnetically suspended in rolling contact with two larger diameter backing rollers 1, 2. In the arrangement shown the backing rollers, which are also of hardened steel, are journalled into a brass housing from which the lower part 4 of the working roller 3 extends and which also encloses two parallel permanent magnets 5. An electromagnet may alternatively be used, and in a further modification the backing rollers 1, 2 are themselves suspended magnetically in rolling contact with three further such rollers. The semi-conductor wafer 11 is mounted on an elastic electrically insulating synthetic resin sheet 12 by electro-static attraction and is scored by a diamond scriber in two mutually orthogonal directions. The score lines 14 may be spaced by as little as 350Á if a 2 mm. diameter working roller 3 is used. A resilient pad 16 supports the wafer 11 while the roller arrangement traverses it in the two orthogonal directions. Finally, the sheet 12 may be stretched so as to space the separated dice to facilitate inspection and removal.</p> |
