| 摘要 |
<p>When a lead-attached electronic component is soldered on one face of a printed circuit board using a flow-soldering bath, particularly, for example, when the inter-lead pitch is narrow, there has been a problem in that solder bridges are generated. In the present invention, a printed circuit board is configured so that a lead-attached electronic component is mounted thereon, the board face on which the lead-attached electronic component is mounted is attached by soldering using a flow-soldering bath, the lead-attached electronic component is disposed in parallel with the flow-soldering direction, and a rearward soldering land (4) having a latticed surface (4a) is provided at the tail end of a group of consecutive soldering lands (3). <IMAGE></p> |
