| 摘要 |
In a method of improving the bonding of a metal coating to an electrically non-conductive base such as a plastic, an adhesive coating comprising a curable thermosetting resin in the A stage in a vaporizable solvent is applied to base, vacuum dried to remove all the solvent at a temperature below the resin curing point, a metal is then deposited on the dried adhesive and finally the resin of the adhesive is cured from the A stage to the C stage by heating. The metal deposited may be Al, Cu, Ni, Co formed by vacuum deposition or by electroless deposition. With electroless coating the adhesive is first sensitized with SnCl2 and then seeded with PdCl2. The metal may then be electro-plated with Cu and possible further layers of Ni and Cr. The resin layer may be cured before or after the electro-plating. The non-conductive base may be such thermosetting resins as phenol-formaldehyde, resorcinol formaldehyde, urea formaldehyde and melamine formaldehyde, epoxy, furane, diallylphthalate, polyethylene terephthalate, and polyesters which may be reinforced with glass, asbestos and organic fibres. The base may alternatively be steel coated with one of these resins. These resins dissolved in a solvent such as acetone to give a solids content of 10-30% by weight may also be used as the adhesive coating. A curing or hardening catalyst, a thermoplastic resin and modifyers such as nitrile rubbers may also be included in the solution. |
