| 摘要 |
<p>PURPOSE: A dual guide type pickup cylinder for a semiconductor device to stably move up and down is provided to absorb vibration and impact by including a buffer unit composed of a urethane ring and an O-ring in a first guide shaft and a second guide shaft. CONSTITUTION: A cylinder body(10) is received in a cylinder guide(20). A first guide shaft(31) and a second guide shaft(32) are mounted on the cylinder guide and guide the vertical movement of the cylinder body. A vacuum shaft(40) vertically moves in the cylinder body and includes a vacuum absorption unit(50) to absorb or detach a semiconductor device. A guide block(60) is composed of a mounting plate(61) and an insertion unit(62) on the lower side of the cylinder guide. The cylinder unit is inserted into a first block groove(13) formed in the cylinder body and a second block groove(23) formed in the cylinder guide.</p> |
