| 摘要 |
The present invention provides various embodiments for apparatuses and methods of manufacturing low profile housings for electronic and/or optoelectronic devices. Some embodiments provide low profile housings with a hollow casing comprising a first surface, second surface, and at least one lateral side surface. The housing is substantially light-diffusive. At least one cap is provided for sealing an end of the casing, with the at least one cap being sized to account for variations in the casing. At least one light emitting device, such as an LED, may be mounted within the casing. A mounting means may be included for mounting the housing to a mounting surface. |
