| 发明名称 |
Inkjet ink composition |
| 摘要 |
The invention is to provide a metal ink composition for ink-jet and more particularly, a metal ink composition which causes no formation of cracks on a PCB substrate, allows a low curing temperature, and provides improved adhesive strength even after coating. |
| 申请公布号 |
US8389601(B2) |
申请公布日期 |
2013.03.05 |
| 申请号 |
US20090636378 |
申请日期 |
2009.12.11 |
| 申请人 |
KIM TAE-HOON;KIM DONG-HOON;JUN BYUNG-HO;CHOI JOON-RAK;SEO YOUNG-KWAN;LEE YOUNG-IL;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM TAE-HOON;KIM DONG-HOON;JUN BYUNG-HO;CHOI JOON-RAK;SEO YOUNG-KWAN;LEE YOUNG-IL |
| 分类号 |
B01F17/00;B32B7/12;B32B27/28;B41J2/01;B41J2/17;B41J2/175;B60C1/00;C07F9/90;C08G63/60;C08J3/00;C08K3/08;C08K5/00;C08K5/01;C08K5/09;C08K5/10;C08K5/16;C08L9/00;C08L67/00;C08L73/00;C08L79/00;C09D1/00;C09D4/00;C09D5/00;C09D11/00;C09K3/00;G01D11/00;H01B3/44 |
主分类号 |
B01F17/00 |
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