发明名称 |
Carbon nanotube-reinforced solder caps, and chip packages and systems containing same |
摘要 |
A carbon nanotube solder is formed on a substrate of an integrated circuit package. The carbon nanotube solder exhibits high heat and electrical conductivities. The carbon nanotube solder is used as a solder microcap on a metal bump for communication between an integrated circuit device and external structures.
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申请公布号 |
US8391016(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20090583831 |
申请日期 |
2009.08.25 |
申请人 |
HWANG CHI-WON;INTEL CORPORATION |
发明人 |
HWANG CHI-WON |
分类号 |
H01L23/488 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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