发明名称 Semiconductor device and manufacturing method thereof
摘要 An object is to provide a semiconductor device with a novel structure. A semiconductor device includes a first transistor, which includes a channel formation region provided in a substrate including a semiconductor material, impurity regions, a first gate insulating layer, a first gate electrode, and a first source electrode and a first drain electrode, and a second transistor, which includes an oxide semiconductor layer over the substrate including the semiconductor material, a second source electrode and a second drain electrode, a second gate insulating layer, and a second gate electrode. The second source electrode and the second drain electrode include an oxide region formed by oxidizing a side surface thereof, and at least one of the first gate electrode, the first source electrode, and the first drain electrode is electrically connected to at least one of the second gate electrode, the second source electrode, and the second drain electrode.
申请公布号 US8389417(B2) 申请公布日期 2013.03.05
申请号 US20100945516 申请日期 2010.11.12
申请人 YAMAZAKI SHUNPEI;KOYAMA JUN;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;KOYAMA JUN
分类号 H01L21/302;H01L21/461 主分类号 H01L21/302
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