发明名称 |
Material for forming electroless plate, coating solution for adhering catalyst, method for forming electroless plate, and plating method |
摘要 |
A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a hydrophilic (meth)acrylic resin constituted with a hydrophilic monomer and a hydrophobic monomer and containing the hydrophobic monomer at a ratio of 50 to 90 mol %. This material for forming electroless plate shows favorable catalyst adhering property, and shows no delamination of the catalyst adhering layer from the non-conductive base material, no dissolution of the catalyst adhering layer into a plating solution, and no discoloration of plate layer during the catalyst adhering step, development step and other steps. |
申请公布号 |
US8389123(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20080525374 |
申请日期 |
2008.02.01 |
申请人 |
OHTA TETSUJI;KITAMURA KEIKO;WATANABE MITSUHIRO;KIMOTO CO., LTD.;JAPAN SURFACE TREATMENT INSTITUTE CO., LTD. |
发明人 |
OHTA TETSUJI;KITAMURA KEIKO;WATANABE MITSUHIRO |
分类号 |
B32B27/00;C25D5/54 |
主分类号 |
B32B27/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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