发明名称 |
Metal strip, connector, and method of manufacturing metal strip |
摘要 |
A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus line) of a Sn-(1 to 4% by mass)Cu alloy to form a Cu-Sn compound layer or a Cu—Ni—Sn-compound layer on the Ni plating layer and a Sn layer or a Sn—Cu-ally layer on the Cu—Sn compound layer or the Cu—Ni—Sn-compound layer. The metal strip is further fabricated into a connector. |
申请公布号 |
US8389854(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20080602385 |
申请日期 |
2008.10.14 |
申请人 |
OKAMOTO MASAHIDE;IKEDA OSAMU;HITACHI, LTD. |
发明人 |
OKAMOTO MASAHIDE;IKEDA OSAMU |
分类号 |
H01B7/00 |
主分类号 |
H01B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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