| 摘要 |
A method for polishing the edge of a semiconductor wafer comprises (a) providing a semiconductor wafer which has been polished on its side surfaces and which has a rounded edge; (b) polishing the edge of the wafer by fixing the semiconductor wafer on a centrally rotating chuck, delivering the wafer to a centrally rotating polishing drum, which is inclined with respect to the chuck and to which a polishing pad containing fixedly bonded abrasives is applied, and pressing semiconductor wafer and polishing drum onto one another while a polishing agent solution containing no solids is continuously supplied. |
