发明名称 |
Substrate polishing apparatus |
摘要 |
A substrate polishing apparatus is provided for preventing excessive polishing and insufficient polishing, and enabling a quantitative setting of an additional polishing time. The substrate polishing apparatus comprises a mechanism for polishing a substrate to be polished; a film thickness measuring device for measuring the thickness of a thin film deposited on the substrate; an interface for entering a target thickness for the polished thin film; a storage area for preserving past polishing results; and a processing unit for calculating a polishing time and a polishing rate. The substrate polishing apparatus builds an additional polishing database for storing data acquired from the result of additional polishing in the storage area. |
申请公布号 |
US8388409(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20100700917 |
申请日期 |
2010.02.05 |
申请人 |
NAKAO HIDETAKA;KAWABATA YASUMITSU;KATSUMATA YOSHIFUMI;OZAWA NAOKI;SASAKI TATSUYA;SHIGETA ATSUSHI;EBARA CORPORATION;KABUSHIKI KAISHA TOSHIBA |
发明人 |
NAKAO HIDETAKA;KAWABATA YASUMITSU;KATSUMATA YOSHIFUMI;OZAWA NAOKI;SASAKI TATSUYA;SHIGETA ATSUSHI |
分类号 |
B24B51/00;B24B49/03;B24B49/12;B24D7/12;H01L21/304 |
主分类号 |
B24B51/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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