发明名称 MOISTURE-PROOF INSULATING MATERIAL
摘要 Provided are: a moisture-proof insulating material having superior long-term insulating reliability and adhesiveness to polyimides and glass substrates, and has a solid content concentration that can secure a thickness that realizes sufficient moisture-proof performance after application and drying in a viscosity region that can be easily coated by means of a dispenser; and an electronic component that has been insulation-processed by means of the moisture-proof insulating material. The moisture-proof insulating material contains a styrene-based thermoplastic elastomer, a tackifying agent, and a solvent, and is characterized by the solvent containing an aliphatic hydrocarbon solvent (for example, methylcyclohexane or cyclohexane) having a boiling point that is at least 80° C. and less than 110° C. The solvent preferably further contains an aliphatic hydrocarbon solvent (for example, ethylcyclohexane or dimethylcyclohexane) having a boiling point that is at least 110° C. and less than 140° C.
申请公布号 KR20130021416(A) 申请公布日期 2013.03.05
申请号 KR20127033830 申请日期 2011.10.17
申请人 SHOWA DENKO K.K. 发明人 OOGA KAZUHIKO;AZUMA RITSUKO
分类号 C08L53/00;C09D5/00;H01B3/44;H05K3/28 主分类号 C08L53/00
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