| 摘要 |
<p>The invention relates to a method and a semi-finished product (33) for the production of an inlay, particularly for chip cards, prepaid cards, identification documents, or the like, comprising at least two electronic components, wherein all electronic components can be disposed on a carrier substrate (36) in a relative arrangement for configuring a component arrangement (13), and the component arrangement is disposed in a filler material (12). The invention further relates to a method for the production of a card using a semi-finished product, and to a card produced using the semi-finished product.</p> |
