发明名称 Pre-distortion based impedence discontinuity remediation for via stubs and connectors in printed circuit board design
摘要 Embodiments of the present invention address deficiencies of the art in respect to via structure utilization in a PCB design and provide a novel and non-obvious method, system and computer program product for impedance discontinuity remediation for via stubs and connectors in a PCB. In one embodiment a method for impedance discontinuity remediation in a PCB can be provided. The method can include configuring a pre-distortion filter to negate an impedance discontinuity in an electrical signal caused by a transmission line with one of a via stub or a connector. The method further can include pre-distortion filtering an electrical signal before transmitting the electrical signal over the transmission line. Finally, the method can include transmitting the pre-distortion filtered electrical signal over the transmission line.
申请公布号 US8390393(B2) 申请公布日期 2013.03.05
申请号 US201213603386 申请日期 2012.09.04
申请人 BANDHOLZ JUSTIN P.;CASES MOISES;CHRISTOPHER ROBERT J.;DE ARAUJO DANIEL;HERRMAN BRADLEY D.;MATOGLU ERDEM;MUTNURY BHYRAV M.;PATEL PRAVIN S.;PHAM NAM H.;INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 BANDHOLZ JUSTIN P.;CASES MOISES;CHRISTOPHER ROBERT J.;DE ARAUJO DANIEL;HERRMAN BRADLEY D.;MATOGLU ERDEM;MUTNURY BHYRAV M.;PATEL PRAVIN S.;PHAM NAM H.
分类号 H03H7/38 主分类号 H03H7/38
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