发明名称 |
Manufacturing method of embedded circuit substrate |
摘要 |
An embedded circuit substrate comprising: a core structure having a first surface and a second surface opposite to each other; a first patterned conductive layer disposed on the first surface and embedded in the core structure; a second patterned conductive layer disposed on the second surface and embedded in the core structure; and a plurality of conductive blocks disposed in the core structure for conducting the first patterned conductive layer and the second patterned conductive layer is provided. Furthermore, a manufacturing method of an embedded circuit substrate is also provided. |
申请公布号 |
US8387239(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20090622052 |
申请日期 |
2009.11.19 |
申请人 |
WANG CHIEN-HAO;LEE MING-CHIANG;ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
WANG CHIEN-HAO;LEE MING-CHIANG |
分类号 |
H05K3/02;H05K3/10 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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