发明名称 |
Light-emitting diode (LED) package systems |
摘要 |
A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at least one first thermally conductive structure. At least one light-emitting diode (LED) is disposed over the at least one second thermally conductive structure.
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申请公布号 |
US8390009(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20100706040 |
申请日期 |
2010.02.16 |
申请人 |
WANG CHUNG YU;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
发明人 |
WANG CHUNG YU |
分类号 |
H01L33/00 |
主分类号 |
H01L33/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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