| 摘要 |
PURPOSE: A system and a method for detecting a faulty bump of a flip-chip are provided to detect the faulty bump of the flip-chip without influencing the recognition of the flip-chip and a flip-chip mounting speed, thereby increasing the inspecting speed for a faulty flip-chip and the speed for compensating a normal flip-chip position. CONSTITUTION: A system for detecting a faulty bump of a flip-chip comprises a pick-up module(10), a photographing module(20), a recognition module(30), and a detection module(40). The pick-up module picks up the flip-chip, thereby mounting the same on a substrate. The photographing module obtains images of the flip-chip picked up by the pick-up module. The recognition module recognizes a plurality of bumps included in the flip-chip in the images of the flip-chip. The detecting module detects an excess bump and a lack bump included in the flip-chip based on the recognition of the bumps. [Reference numerals] (30) Recognition module; (40) Detection module |
