发明名称 |
SUBSTRATE STRIP AND MOLDING METHOD THEREFOR |
摘要 |
PURPOSE: A substrate strip and a molding method thereof are provided to improve throughput by reducing voids and the deformation of a substrate. CONSTITUTION: Units are arranged in a first row(110). A second row(120) is parallel to the first row. The units are arranged in the second row. A trench(130) is formed between the first row and the second row. A mold gate supplies molding resin to the first and second rows at the same time.
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申请公布号 |
KR20130021251(A) |
申请公布日期 |
2013.03.05 |
申请号 |
KR20110083655 |
申请日期 |
2011.08.22 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KANG, HO SHIK;OH, SOO HYEONG;PARK, JONG TAE |
分类号 |
H01L23/28;H01L23/02;H01L23/16 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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