发明名称 SUBSTRATE STRIP AND MOLDING METHOD THEREFOR
摘要 PURPOSE: A substrate strip and a molding method thereof are provided to improve throughput by reducing voids and the deformation of a substrate. CONSTITUTION: Units are arranged in a first row(110). A second row(120) is parallel to the first row. The units are arranged in the second row. A trench(130) is formed between the first row and the second row. A mold gate supplies molding resin to the first and second rows at the same time.
申请公布号 KR20130021251(A) 申请公布日期 2013.03.05
申请号 KR20110083655 申请日期 2011.08.22
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KANG, HO SHIK;OH, SOO HYEONG;PARK, JONG TAE
分类号 H01L23/28;H01L23/02;H01L23/16 主分类号 H01L23/28
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