发明名称 Methods of forming semiconductor device structures and semiconductor device structures including a uniform pattern of conductive lines
摘要 Methods of forming semiconductor device structures are disclosed. One method comprises forming a plurality of loops of a conductive material. Each loop of the plurality of loops comprises a uniform pattern. In one embodiment, a portion of the conductive material is removed from at least one location in each loop of the plurality of loops. Contacts are formed to the conductive material. A semiconductor device structure is also disclosed.
申请公布号 US8390051(B2) 申请公布日期 2013.03.05
申请号 US20100844560 申请日期 2010.07.27
申请人 BICKSLER ANDREW;MICRON TECHNOLOGY, INC. 发明人 BICKSLER ANDREW
分类号 H01L29/788 主分类号 H01L29/788
代理机构 代理人
主权项
地址