发明名称 |
Methods of forming semiconductor device structures and semiconductor device structures including a uniform pattern of conductive lines |
摘要 |
Methods of forming semiconductor device structures are disclosed. One method comprises forming a plurality of loops of a conductive material. Each loop of the plurality of loops comprises a uniform pattern. In one embodiment, a portion of the conductive material is removed from at least one location in each loop of the plurality of loops. Contacts are formed to the conductive material. A semiconductor device structure is also disclosed.
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申请公布号 |
US8390051(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US20100844560 |
申请日期 |
2010.07.27 |
申请人 |
BICKSLER ANDREW;MICRON TECHNOLOGY, INC. |
发明人 |
BICKSLER ANDREW |
分类号 |
H01L29/788 |
主分类号 |
H01L29/788 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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