SUBSTRATE BONDING APPARATUS AND METHOD OF ASSEMBLING PARTS THEREOF

摘要

PURPOSE: A substrate bonding apparatus and an assembling method thereof are provided to reduce fraction defects by applying uniform pressure on a substrate by using a pad part. CONSTITUTION: A table(130) is arranged in a vacuum chamber. The table includes a first magnetic material. A hot plate(140) faces the table and includes a second magnetic material. A pad part(150) applies the pressure of the table to the substrate.