发明名称 |
LIGHT EMITTING ELEMENT PACKAGE, LIGHT SOURCE MODULE, AND LIGHTING SYSTEM INCLUDING LIGHT SOURCE MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of a light emitting element package. <P>SOLUTION: A light emitting element package according to one embodiment of the invention includes: a package body having a cavity having a wall part and a bottom surface; a light emitting element positioned in the cavity; a heat radiating part inserted into the package body and positioned at a lower part of the light emitting element; and a second electrode pattern positioned around the heat radiating part and electrically connected with the light emitting element through wire bonding. The second electrode pattern has a first region where a wire is bonded and a second region connected with the first region. The width of the first region is different from the width of the second region. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013046072(A) |
申请公布日期 |
2013.03.04 |
申请号 |
JP20120183660 |
申请日期 |
2012.08.22 |
申请人 |
LG INNOTEK CO LTD |
发明人 |
JEONG SU-JONG;MOON YON TAE;CHO YOUNG JUN;HWANG SON KYO;KIM BYEONG-MOK;KWON SEO YEON |
分类号 |
H01L33/62;F21S2/00;F21V29/00;F21Y101/02;H01L33/64 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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