发明名称 PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To achieve effective cooling of a tray and suppression of consumption, in a plasma processing apparatus including a tray capable of conveying a plurality of substrates. <P>SOLUTION: A substrate support 11 for supporting the outer peripheral edge on the underside c of a substrate 5 is provided on the hole wall of substrate housing holes 27A-27I in a tray 3. The substrate mounting portions 27A-27I of a stage 21 are inserted into substrate housing holes 4A-4I, and a substrate 5 is delivered from the substrate support 11 to the substrate mounting surface 28. The lower portion of the substrate support 11 has a tapered surface 11b the projection amount of which increases gradually toward the upper side 3a of the tray 3. The side surface of a substrate mounting portion 11 has an inclined surface 29 fitting to the tapered surface 11b, and supports the substrate by abutting against the tapered surface 11b so as to form a clearance S1 between the proximal part 21a of the stage 21 and the tray 3. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013045936(A) 申请公布日期 2013.03.04
申请号 JP20110183528 申请日期 2011.08.25
申请人 PANASONIC CORP 发明人 OKITA SHOGO;WATANABE SHOZO
分类号 H01L21/673;H01L21/3065;H01L21/683;H05H1/46 主分类号 H01L21/673
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