发明名称 MOUNTING STRUCTURE OF CIRCUIT BOARD HAVING MULTI-LAYERED CERAMIC CAPACITOR THEREON
摘要 <P>PROBLEM TO BE SOLVED: To provide a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon. <P>SOLUTION: There is disclosed herein a mounting structure of a circuit board having a multi-layered ceramic capacitor thereon, the multi-layered ceramic capacitor including dielectric sheets laminated thereon and external terminal electrodes formed at both ends thereof, the dielectric sheets having internal electrodes formed thereon, and the external terminal electrodes being connected in parallel with the internal electrodes. The internal electrodes of the multi-layered ceramic capacitor are disposed to be in parallel with the circuit board, the external terminal electrodes are bonded to lands of the circuit board by a conductive material, and a bonding height (Ts) of the conductive material is lower than a sum of a gap (Ta) between the circuit board and a bottom surface of the multi-layered ceramic capacitor and a thickness (Tc) of a cover layer on a lower portion of the multi-layered ceramic capacitor, whereby vibration noise can be greatly reduced. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013046069(A) 申请公布日期 2013.03.04
申请号 JP20120182143 申请日期 2012.08.21
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 AHN YON-GYU;YI BYON-HWA;PARK MN-CHOL;PARK SAN-SOO;PARK DON-SEOK
分类号 H01G2/06;H01G4/12;H01G4/30;H05K1/18 主分类号 H01G2/06
代理机构 代理人
主权项
地址