| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a planar body for temperature measurement capable of easily optimizing the in-plane temperature distribution or temperature rise characteristics of the mounting surface of an electrostatic chuck device or the cooling characteristics when cooling, by simply mounting the planar body for temperature measurement on the mounting surface of the electrostatic chuck device, without using a semiconductor wafer itself becoming a product, and to provide a temperature measurement device including the planar body for temperature measurement. <P>SOLUTION: In a wafer for temperature measurement (planar body for temperature measurement) 1, an insulating adhesive 3 is stuck to a surface 2a of a wafer 2 entirely, a heater element 4 is provided on the insulating adhesive 3, temperature measurement regions 5 for measuring the temperature of the surface 2a of the wafer 2 are provided in a region on a surface 3a of the insulating adhesive 3 excepting the heater element 4, and these heater element 4 and temperature measurement regions 5 are covered with an insulating film 6. <P>COPYRIGHT: (C)2013,JPO&INPIT |
