| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an anisotropic conductive paste capable of sufficiently securing bond strength at a connection part and having high connection reliability. <P>SOLUTION: An anisotropic conductive paste of the present invention contains: 10 mass% or more and 50 mass% or less of lead-free solder powder having a melting point of 240°C or below; and 50 mass% or more and 90 mass% or less of a thermosetting resin composition containing a thermosetting resin and a hardener. The hardener contains a carboxylic acid based hardener, an imidazole based hardener, and an amine based hardener. <P>COPYRIGHT: (C)2013,JPO&INPIT |
