发明名称 |
WIRING BOARD WITH BUILT-IN ELEMENT AND MANUFACTURING METHOD THEREFOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board with a built-in element which has a chip-like electric element and a film element, shortens connection distances of these elements to improve high frequency property, and is downsized and highly integrated. <P>SOLUTION: The wiring board with a built-in element comprises: a double-sided wiring board having a pair of a first wiring layer and a second wiring layer which are arranged opposite each other and a first insulation layer arranged between their wiring layers; a third wiring layer provided in way opposite to the first wiring layer of the double-sided wiring board; a second insulation layer provided between the first wiring layer and the third wiring layer; a chip-like electric element provided in the second insulation layer and mounted to the first wiring layer; and a film element electrically connected to the first wiring layer, provided on the first insulation layer or in the first insulation layer in way opposite to the electric element and having a trimming region exposed outward from the electric element. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013045898(A) |
申请公布日期 |
2013.03.04 |
申请号 |
JP20110182793 |
申请日期 |
2011.08.24 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
SERIZAWA TORU;AMAMI SHINYA;TANAKA MASAYA |
分类号 |
H05K3/46;H01L23/12;H05K9/00 |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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