| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve such problems that the conventional resin material coating method requires time to make a resin material flow to the extent of a heating plate surface to be coated due to a natural flow by gravity, and also easily causes uneven coating thickness and defective coating during flow, while the practical use of thin films requires both the quality of the films and productivity because uneven coating thickness and defective coating occurring in forming an electronic component using the thin resin film reduce the effect of using the thin films in half and lead to poor performance of the electronic component. <P>SOLUTION: It is feasible to discharge an even amount of the resin onto the heating plate by utilizing an ejecting method using a needle valve as the method of applying the resin material. Further, the efficient and even ejection of the resin is practicable by installing a plurality of resin supply points according to the width of applying the resin. It is also feasible to control the grain diameter and amount of the resin to be ejected. It is feasible to form a thin film on a base material stably at a high speed, without being likely to be influenced by variations in the viscosity of the resin, by evaporating the films while the resin is evenly discharged, because the application of the resin is not of the type of a natural flow by gravity. <P>COPYRIGHT: (C)2013,JPO&INPIT |
