| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a flat heat pipe suitable for cooling a semiconductor chip. <P>SOLUTION: The heat pipe 10 includes a strut 12 for connecting an upper plate 2 and a lower plate 6 of the heat pipe in the heat pipe. The strut 12 is provided in a position not overlapped with the attached semiconductor chip 26 in a planar view of the heat pipe 10. A plurality of the struts 12 may be provided. The strut 12 is arranged away from a position directly below the semiconductor chip 26, and thereby, a working fluid freely moves immediately below the semiconductor chip. The strut 12 does not disturb the cooling of the semiconductor chip, and cooling efficiency is not impaired. <P>COPYRIGHT: (C)2013,JPO&INPIT |
