发明名称 FLEXIBLE PRINTED WIRING BOARD AND METHOD OF MANUFACTURING FLEXIBLE PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexible printed wiring board, along with a manufacturing method of the same, capable of effectively preventing occurrence of coating failure such as cracking in a region where an insulating layer is formed during a manufacturing step for the flexible printed wiring board. <P>SOLUTION: A flexible printed wiring board 10 includes a base material layer 11, a wiring circuit 12a, and an insulating layer 13 made from photosensitive resin, and is equipped with an insulating layer coating region Q1 that is coated with the insulating layer 13, and an insulating layer non-coating region Q2 that is not coated with the insulating layer 13. In the flexible printed wiring board 10, a border line K1 between the insulating layer coating region Q1 and the insulating layer non-coating region Q2, viewed along the direction vertical to a surface H of the flexible printed wiring board 10, crosses with a line T2 which represents a side surface 12a-1 of the wiring circuit 12a covered with the insulating layer coating region Q1, and intersection angles A1-A4 at the intersection thereof is formed to be an acute angle. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013045818(A) 申请公布日期 2013.03.04
申请号 JP20110181133 申请日期 2011.08.23
申请人 SUMITOMO ELECTRIC PRINTED CIRCUIT INC 发明人 UEDA HIROSHI;NOGUCHI KO;UEHARA SUMITO
分类号 H05K3/28 主分类号 H05K3/28
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