| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which reduces a gap between a master substrate and a small substrate in a state where the small substrate is connected with the master substrate in order to meet a demand for further height reduction. <P>SOLUTION: A card edge connector 1 is mounted and used on a connector mounting surface 22a of a main board 22 for connecting a memory module 2 with the main board 22. The card edge connector 1 includes a latch part 17 for pressing the memory module 2 that is going to displace in a direction away from the connector mounting surface 22a, toward the connector mounting surface 22a. The latch part 17 is formed so as to elastically displace in the direction away from the connector mounting surface 22a. <P>COPYRIGHT: (C)2013,JPO&INPIT |
