| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which transformers are used on signal propagation paths and the insulating isolation between semiconductor chips is improved. <P>SOLUTION: A semiconductor device includes: first and second semiconductor chips that are mounted on a substrate; a third semiconductor chip that is mounted on the substrate and outputs a control signal controlling the operation of the first and second semiconductor chips; a first transmission transformer that is mounted on the substrate and in which a reception-side terminal is connected to the third semiconductor chip and a transmission-side terminal is connected to the first semiconductor chip; and a second transmission transformer that is mounted on the substrate and in which a reception-side terminal is connected to the third semiconductor chip and a transmission-side terminal is connected to the second semiconductor chip. The control signal is transmitted from the third semiconductor chip to the first semiconductor chip and the second semiconductor chip via the first transmission transformer and the second transmission transformer, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT |
