发明名称 |
MANUFACTURING METHOD OF WIRING BOARD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which achieves high electric insulation reliability. <P>SOLUTION: A manufacturing method of a printed board comprises the steps of: depositing an insulation layer 3 on a surface of a multiple patterning board; depositing a base metal layer on the entire surface of the insulation layer 3; depositing a plating metal layer on a surface of the base metal layer with an electrolytic plating method so as to have a wiring conductor pattern corresponding to a wiring conductor 4 and a dummy pattern 23b covering an area ranging from the wiring conductor pattern to a cutting region B; removing the base metal layer exposed from the wiring conductor pattern and the dummy pattern 23b; removing the dummy pattern 23b and the base metal layer located under the dummy pattern 23b; and cutting the cutting regions B and dividing wiring board regions A into individual wiring boards. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013045959(A) |
申请公布日期 |
2013.03.04 |
申请号 |
JP20110183822 |
申请日期 |
2011.08.25 |
申请人 |
KYOCER SLC TECHNOLOGIES CORP |
发明人 |
ARAKAWA YOSUKE |
分类号 |
H05K3/00;H05K1/02;H05K3/18 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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