发明名称 MANUFACTURING METHOD OF WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which achieves high electric insulation reliability. <P>SOLUTION: A manufacturing method of a printed board comprises the steps of: depositing an insulation layer 3 on a surface of a multiple patterning board; depositing a base metal layer on the entire surface of the insulation layer 3; depositing a plating metal layer on a surface of the base metal layer with an electrolytic plating method so as to have a wiring conductor pattern corresponding to a wiring conductor 4 and a dummy pattern 23b covering an area ranging from the wiring conductor pattern to a cutting region B; removing the base metal layer exposed from the wiring conductor pattern and the dummy pattern 23b; removing the dummy pattern 23b and the base metal layer located under the dummy pattern 23b; and cutting the cutting regions B and dividing wiring board regions A into individual wiring boards. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013045959(A) 申请公布日期 2013.03.04
申请号 JP20110183822 申请日期 2011.08.25
申请人 KYOCER SLC TECHNOLOGIES CORP 发明人 ARAKAWA YOSUKE
分类号 H05K3/00;H05K1/02;H05K3/18 主分类号 H05K3/00
代理机构 代理人
主权项
地址