| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which inhibits an occurrence of torsion or deformation, thereby preventing implementation to a mother board from being disturbed. <P>SOLUTION: A semiconductor device comprises: a single wiring board 10; a first semiconductor chip 211 implemented on the wiring board 10; a second semiconductor chip 220 implemented on the wiring board 10 in parallel with the first semiconductor chip 211; and an encapsulation member 60 covering the first semiconductor chip 211 and the second semiconductor chip 220. The second semiconductor chip 220 is a chip laminate in which a plurality of semiconductor chip pieces 221, 222 are laminated in a height direction. A top face of the first semiconductor chip 211 and a top face of the second semiconductor chip 220 are the same in height from a surface of the wiring board 10 with each other. <P>COPYRIGHT: (C)2013,JPO&INPIT |
