发明名称 WIRING BOARD AND MOUNTING STRUCTURE THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board having improved electrical reliability and a mounting structure therefor. <P>SOLUTION: A wiring board 3 according to one embodiment of the present invention includes an insulating layer comprising: a plurality of first inorganic insulating particles 14a which are connected to each other via a first neck structure 13a and contain silicon oxide; and a resin member 15 which is disposed between the first inorganic insulating particles 14a and contains a resin having a siloxane bond as a skeleton. A mounting structure 1 according to one embodiment of the present invention includes the wiring board 3 and an electronic component 2 mounted on the wiring board 3. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013046012(A) 申请公布日期 2013.03.04
申请号 JP20110184704 申请日期 2011.08.26
申请人 KYOCERA CORP 发明人 HAYASHI KATSURA
分类号 H05K1/03;H05K3/46 主分类号 H05K1/03
代理机构 代理人
主权项
地址