ADHESIVE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE FILM, COVER LAY FILM, AND CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide an adhesive resin composition free from the deterioration in adhesive force between a wiring layer and an adhesive layer even if repeatedly put under high temperature environment.

SOLUTION: The adhesive resin composition contains (A) a siloxane-containing polyimide resin having ethylenically unsaturated double bond and (B) a bis-phenol type vinyl ester resin, wherein the (B) component is contained in a range of ≤25 pts.wt. based on 100 pts.wt. of the total of the (A) component and the (B) component. The (A) component is prepared using the diamine component satisfying (i) to (iii) as a diamine component of a raw material: (i) ≥75 mol and ≤100 mol siloxane unit-containing diamine is contained based on 100 mol in total of diamine component; (ii) the siloxane unit-containing diamine contains at least siloxane diamine having the ethylenically unsaturated double bond; and (iii) 1-100 mol siloxane diamine having ethylenically unsaturated double bond is contained based on 100 mol of siloxane unit-containing unsaturated double bond.

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