| 摘要 |
PURPOSE: A thin ceramic PCB(printed Circuit Board) module and a thermally conductive adhesive composition for excellent heat sink are provided to combine a substrate layer and a heat sinking plane using a thermally conductive adhesive composition, thereby improving transference of generated heat to a heat sinking plane. CONSTITUTION: A substrate layer(10) is made of insulative thin ceramics. A circuit is formed on a patterned layer(20) printed by a conducting substance on top of the substrate layer. A heating element(30) is mounted on top of the substrate layer. A heat sinking plane(40) dissipates generated heat from the heating element. An adhesive composition(50) transfers the generated heat from the heating element to the heat sinking plane. |
