| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a long-life collet having a low-cost and simple configuration similar to the conventional one, which can solve the problem of bringing back a semiconductor chip without deteriorating the accuracy of mounting the semiconductor chip and can achieve high-speed mounting. <P>SOLUTION: A collet 10 comprises: a cylindrical protrusion 14 of a hard material, which is fixed by pressing into a conventional semiconductor chip suction hole at the end of a shank 13 of a hard material; and a rubber chip 12 which is externally fit to the cylindrical protrusion 14 and fixed by a rubber-like fastening force. An end suction surface 14a of the cylindrical protrusion 14 is constituted on the same plane as an end suction surface 12a of the rubber chip 12 or in a shape in which the end suction surface 14a is drawn down by a height h or less with respect to the end suction surface 12a, so as not to protrude from the end suction surface 12a of the rubber chip 12. The height h is 0.2 mm or less. <P>COPYRIGHT: (C)2013,JPO&INPIT |
