发明名称 BURN-IN SYSTEM AND BURN-IN METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a burn-in system and a burn-in method capable of guaranteeing that a semiconductor wafer has been burned-in under a correct condition without inspecting a wafer for burn-in at each burn-in. <P>SOLUTION: The burn-in system includes a semiconductor wafer which contains a plurality of chip regions 40 where an integrated circuit 41 is formed, and a burn-in wafer which supplies a predetermined voltage and a burn-in signal to the semiconductor wafer under a condition in which it is laminated to the semiconductor wafer. The semiconductor wafer includes a plurality of test circuits 42 formed in association with the integrated circuit 41. The test circuit 42 is supplied with a burn-in signal and a predetermined voltage supplied to a corresponding integrated circuit 41. The test circuit 42 includes a burn-in history element which, when burn-in is correctly performed, represents a state different from that before execution of burn-in while holding the state. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013045905(A) 申请公布日期 2013.03.04
申请号 JP20110183019 申请日期 2011.08.24
申请人 DENSO CORP 发明人 HARADA TOMOYUKI
分类号 H01L21/66;G01R31/26 主分类号 H01L21/66
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