| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for obtaining a polishing pressure distribution from a two-dimensional distribution of a surface potential measured by an EFM. <P>SOLUTION: The method of the invention is a method for obtaining a polishing pressure distribution of chemical mechanical polishing. The method includes processes of obtaining a surface potential image by measuring a surface potential of an object to be polished which is polished by a polishing apparatus with an electric force microscope, and transforming the surface potential to a polishing pressure on the basis of data which shows a relationship between a surface potential and a polishing pressure. <P>COPYRIGHT: (C)2013,JPO&INPIT |
