| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermosetting resin resulting in a cured product having characteristics of a low dielectric constant and a low dielectric loss. <P>SOLUTION: The thermosetting resin having a dihydrobenzoxazine ring in its main chain is characterized by being obtained by reacting dihydroxydiphenyl, diamine, and aldehyde, and containing in its molecular structure 34-51 mass% biphenyl backbone deriving from the dihydroxydiphenyl. It is preferable that the dihydroxydiphenyl is biphenol and that the aldehyde is formaldehyde. <P>COPYRIGHT: (C)2013,JPO&INPIT |
